Scali wrote:This can pretty much be summarized into: "Bad lead-free solder' (plus some other minute details, completely overblown in your post).
I haven't blown anything out of proportion. Claiming that the massive nVidia failures were caused mostly by unleaded solder is untruthful in the face of the overwhelming evidence:
Nvidia chips show underfill problems
Underfill is basically a glue that surrounds the bumps, keeps them from getting contaminated, and moisture free. It also provides some mechanical support for the chips. There are two properties of underfill, Tg and stiffness. Tg is the Temperature of Glassification, which means the temperature at which it loses all stiffness. Instead of thinking about it melting, think of it turning to jello. Stiffness is how hard it is before it melts or turns to jello.
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Remember when we said that Nvidia engineering wasn’t abjectly stupid? Scratch that. Remember when we said we were going to break out the electron microscope? It’s time. Remember the part about the PI layer being necessary for stiffer underfills? Guess what?
Once again, this is not saying that they will fail, or the one you have will fail. We are simply stating that according to all the packaging experts we talked to, none of them could come up with a scenario where this was not a massive problem. Once again, time will tell.
And time did tell. They did fail. En masse. Like I said, when these cards are put to heavy use, they have a 100% failure rate. And it's not a matter of re-balling the chip. Among those that do in fact replace nVidia northbridges on Laptop motherboards, more often than not, they use a fresh old stock part.
Scali wrote:Thing is, many users have reported that a ghett0 reflow in their oven fixed their cards. Which wouldn't work if it was really the chip itself that had cracked.
That's because a reflow accomplishes two things. Firstly, it reflows the solder between the chip and the PCB, but secondly, it also reflows the bumps inside the chip with the pads. And consider as well that reflowing doesn't solve the underlying problem of the unleaded solder between the chip and the PCB, much less the incorrect bump/pad alloy. That means to say, even if the chip were professionally re-balled (the unleaded solder balls were replaced with leaded solder balls), the chip would still fail and would need to be reflowed to bond the bumps and pads inside the chip itself.
Additionally, if the chip suffered a mechanical catastrophic failure because it cracked when the improper underfill did not allow it to 'float' under high heat, no amount of reflowing or re-balling will bring the chip back to life.
And as for the example you gave with the Xbox360 - when these were re-balled, they did not exhibit this problem, because the chips themselves didn't have any engineering problems - indeed, in their case, it was only the question of the unleaded solder.
obobskivich wrote:Curiosity: is NV40 affected by this? From what I've read the issues started with later production nodes (like 65nm and on), so I'm assuming the 130nm NV40 also predates it, but I could be mistaken (my other reason for this hunch is that 6800U and GT report similarly high throttle temperatures (>110*C) as their FX brethren).
That's a good question. I would imagine not, as I've personally seen an old high-end Dell Inspiron with a mobility Geforce 6 that worked well after many years, and I have a fanless Geforce 6200 which still works quite well (after a re-cap, that is).