This weekend, I reballed the PCI Creative Blaster 3DFX Voodoo Banshee a colleague gave me to try and fix.
The card had artifacting issues on cold boots, that would slowly fade as the chip got hot.
Once properly hot, Glide games worked just fine (starting them while the card was still artifacting would result in garbage output and crashing), but to me that indicated poor solder connections under the chip.
With how poorly these chips were cooled with piddly little heatsinks (the PCB had significant discoloration on the area of the PCB under the chip), I guess the PCB has been bent from the large temperature swings, causing cracked solder balls that expand and reconnect due to thermal expansion when the IC gets hot.
I did attempt a simple reflow before this, but that resulted in fully corrupted graphics in the BIOS, so that didn't do the trick.
I also tried a cheap Chinese replacement chip, but once soldered on, it didn't even get hot and had no output, so it's either a fake or already dead.
So, I pulled that chip back off, and practiced reballing it as the chips I've been reballing before were all ceramic BGA chips (PowerPC processors) rather than plastic BGA chips, which are susceptible to popcorning if not handled correctly.
After that went well, I finally went ahead and reballed the original IC, and soldered it back onto the card.
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An initial test, after giving the PCI edge connector a good clean, results in a clean picure in the BIOS, free of artifacts.
I've still got to test Glide games, but this is a very good sign already.
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